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Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba与Mobile AMD Sempron 3200+对比
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Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba与Mobile AMD Sempron 3200+对比
作者：admin 更新时间：2025-01-12 13:38
参数对比
提醒：数据来源与网络，仅供参考!
名称
Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba
Mobile AMD Sempron 3200+
得分
415
245
TDP
TDP Down
插槽类型
核心数
4
1
线程数
4
1
主频
1.4 GHZ
1.8 GHZ
睿频
发布时间
NA
Q4 2008
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Mobile AMD Sempron 3200+与Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba对比
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