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Hygon C86 3185 8-core与Qualcomm Technologies, Inc SDM670对比
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Hygon C86 3185 8-core与Qualcomm Technologies, Inc SDM670对比
作者：admin 更新时间：2025-01-01 22:54
参数对比
提醒：数据来源与网络，仅供参考!
名称
Hygon C86 3185 8-core
Qualcomm Technologies, Inc SDM670
得分
9,627
2,126
TDP
95 W
TDP Down
插槽类型
核心数
8
8
线程数
16
8
主频
2.0 GHz
2.0 GHZ
睿频
3.0 GHz
发布时间
Q4 2022
NA
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Qualcomm Technologies, Inc SDM670与Hygon C86 3185 8-core对比
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