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vendor Kirin9000E与Qualcomm Technologies, Inc SM8250_AC对比
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vendor Kirin9000E与Qualcomm Technologies, Inc SM8250_AC对比
作者：admin 更新时间：2024-11-01 19:28
参数对比
提醒：数据来源与网络，仅供参考!
名称
vendor Kirin9000E
Qualcomm Technologies, Inc SM8250_AC
得分
4,728
4,830
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
3.1 GHZ
3.2 GHZ
睿频
发布时间
NA
NA
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Qualcomm Technologies, Inc SM8250_AC与vendor Kirin9000E对比
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