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vendor Kirin9000E与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
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vendor Kirin9000E与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
作者：admin 更新时间：2025-02-07 07:53
参数对比
提醒：数据来源与网络，仅供参考!
名称
vendor Kirin9000E
Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre
得分
4,728
566
TDP
TDP Down
插槽类型
核心数
8
4
线程数
8
4
主频
3.1 GHZ
2.3 GHZ
睿频
发布时间
NA
NA
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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与vendor Kirin9000E对比
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