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Qualcomm Technologies, Inc SM8350AC与Hisilicon Kirin9000对比
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Qualcomm Technologies, Inc SM8350AC与Hisilicon Kirin9000对比
作者：admin 更新时间：2025-01-08 04:27
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc SM8350AC
Hisilicon Kirin9000
得分
5,170
4,989
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
3.0 GHZ
3.1 GHZ
睿频
发布时间
NA
NA
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Hisilicon Kirin9000与Qualcomm Technologies, Inc SM8350AC对比
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