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Qualcomm Technologies, Inc SM8250_AC与HiSilicon Kirin 970对比
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Qualcomm Technologies, Inc SM8250_AC与HiSilicon Kirin 970对比
作者：admin 更新时间：2025-01-27 08:05
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc SM8250_AC
HiSilicon Kirin 970
得分
4,830
2,455
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
3.2 GHZ
2.4 GHZ
睿频
发布时间
NA
NA
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HiSilicon Kirin 970与Qualcomm Technologies, Inc SM8250_AC对比
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