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Qualcomm Technologies, Inc SM8250_AC与Mobile AMD Sempron 3300+对比
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Qualcomm Technologies, Inc SM8250_AC与Mobile AMD Sempron 3300+对比
作者：admin 更新时间：2025-01-12 03:00
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc SM8250_AC
Mobile AMD Sempron 3300+
得分
4,830
294
TDP
TDP Down
插槽类型
核心数
8
1
线程数
8
1
主频
3.2 GHZ
2.0 GHZ
睿频
发布时间
NA
Q1 2009
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Mobile AMD Sempron 3300+与Qualcomm Technologies, Inc SM8250_AC对比
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