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Hisilicon Kirin820与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
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Hisilicon Kirin820与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
作者：admin 更新时间：2025-01-20 03:24
参数对比
提醒：数据来源与网络，仅供参考!
名称
Hisilicon Kirin820
Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre
得分
2,226
566
TDP
TDP Down
插槽类型
核心数
8
4
线程数
8
4
主频
2.4 GHZ
2.3 GHZ
睿频
发布时间
NA
NA
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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与Hisilicon Kirin820对比
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