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HiSilicon Kirin 659与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
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HiSilicon Kirin 659与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
作者：admin 更新时间：2025-01-25 16:36
参数对比
提醒：数据来源与网络，仅供参考!
名称
HiSilicon Kirin 659
Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre
得分
1,703
566
TDP
TDP Down
插槽类型
核心数
8
4
线程数
8
4
主频
2.4 GHZ
2.3 GHZ
睿频
发布时间
NA
NA
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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与HiSilicon Kirin 659对比
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