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HiSilicon Kirin 970与Qualcomm Technologies, Inc SM6375对比
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HiSilicon Kirin 970与Qualcomm Technologies, Inc SM6375对比
作者:admin 更新时间:2025-01-02 00:40
参数对比
提醒:数据来源与网络,仅供参考!
名称
HiSilicon Kirin 970
Qualcomm Technologies, Inc SM6375
得分
2,455
4,698
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
2.4 GHZ
2.2 GHZ
睿频
发布时间
NA
Q2 2022
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Qualcomm Technologies, Inc SM6375与HiSilicon Kirin 970对比
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