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HiSilicon Kirin 970与Qualcomm Technologies, Inc SDM670对比
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HiSilicon Kirin 970与Qualcomm Technologies, Inc SDM670对比
作者：admin 更新时间：2024-11-02 12:33
参数对比
提醒：数据来源与网络，仅供参考!
名称
HiSilicon Kirin 970
Qualcomm Technologies, Inc SDM670
得分
2,455
2,126
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
2.4 GHZ
2.0 GHZ
睿频
发布时间
NA
NA
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Qualcomm Technologies, Inc SDM670与HiSilicon Kirin 970对比
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