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HiSilicon Kirin 970与Qualcomm MSM8974PRO-AC对比
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HiSilicon Kirin 970与Qualcomm MSM8974PRO-AC对比
作者:admin 更新时间:2025-01-27 04:58
参数对比
提醒:数据来源与网络,仅供参考!
名称
HiSilicon Kirin 970
Qualcomm MSM8974PRO-AC
得分
2,455
608
TDP
TDP Down
插槽类型
核心数
8
4
线程数
8
4
主频
2.4 GHZ
2.5 GHZ
睿频
发布时间
NA
NA
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Qualcomm MSM8974PRO-AC与HiSilicon Kirin 970对比
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