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Samsung J7 Max LTE SWA board based on MT6757V/WL与Mobile AMD Sempron 3300+对比
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Samsung J7 Max LTE SWA board based on MT6757V/WL与Mobile AMD Sempron 3300+对比
作者：admin 更新时间：2025-01-11 04:08
参数对比
提醒：数据来源与网络，仅供参考!
名称
Samsung J7 Max LTE SWA board based on MT6757V/WL
Mobile AMD Sempron 3300+
得分
950
294
TDP
TDP Down
插槽类型
核心数
8
1
线程数
8
1
主频
2.4 GHZ
2.0 GHZ
睿频
发布时间
NA
Q1 2009
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Mobile AMD Sempron 3300+与Samsung J7 Max LTE SWA board based on MT6757V/WL对比
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