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Haydn based on Qualcomm Technologies, Inc SM8350与Mobile AMD Sempron 3200+对比
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Haydn based on Qualcomm Technologies, Inc SM8350与Mobile AMD Sempron 3200+对比
作者：admin 更新时间：2025-01-04 13:54
参数对比
提醒：数据来源与网络，仅供参考!
名称
Haydn based on Qualcomm Technologies, Inc SM8350
Mobile AMD Sempron 3200+
得分
4,609
245
TDP
TDP Down
插槽类型
核心数
8
1
线程数
8
1
主频
2.8 GHZ
1.8 GHZ
睿频
发布时间
NA
Q4 2008
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Mobile AMD Sempron 3200+与Haydn based on Qualcomm Technologies, Inc SM8350对比
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