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Qualcomm Technologies, Inc BENGALP与Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba对比
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Qualcomm Technologies, Inc BENGALP与Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba对比
作者：admin 更新时间：2024-11-14 11:34
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc BENGALP
Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba
得分
2,134
415
TDP
TDP Down
插槽类型
核心数
8
4
线程数
8
4
主频
2.0 GHZ
1.4 GHZ
睿频
发布时间
NA
NA
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Samsung GrandPrimePlus LTE LTN OPEN rev04 board ba与Qualcomm Technologies, Inc BENGALP对比
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