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Qualcomm Technologies, Inc BENGALP与VIA Samuel 2对比
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Qualcomm Technologies, Inc BENGALP与VIA Samuel 2对比
作者：admin 更新时间：2025-01-26 11:58
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc BENGALP
VIA Samuel 2
得分
2,134
79
TDP
TDP Down
插槽类型
核心数
8
1
线程数
8
主频
2.0 GHZ
睿频
发布时间
NA
Q4 2011
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VIA Samuel 2与Qualcomm Technologies, Inc BENGALP对比
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