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Qualcomm Technologies, Inc BENGALP与Mobile AMD Sempron 3000+对比
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Qualcomm Technologies, Inc BENGALP与Mobile AMD Sempron 3000+对比
作者:admin 更新时间:2025-01-21 13:50
参数对比
提醒:数据来源与网络,仅供参考!
名称
Qualcomm Technologies, Inc BENGALP
Mobile AMD Sempron 3000+
得分
2,134
269
TDP
TDP Down
插槽类型
核心数
8
1
线程数
8
1
主频
2.0 GHZ
1.8 GHZ
睿频
发布时间
NA
Q4 2008
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Mobile AMD Sempron 3000+与Qualcomm Technologies, Inc BENGALP对比
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