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Qualcomm Technologies, Inc SDM636与Mobile AMD Sempron 3400+对比
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Qualcomm Technologies, Inc SDM636与Mobile AMD Sempron 3400+对比
作者：admin 更新时间：2025-01-27 17:31
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc SDM636
Mobile AMD Sempron 3400+
得分
1,854
321
TDP
25 W
TDP Down
插槽类型
SocketS1(S1g1)
核心数
8
1
线程数
8
1
主频
1.8 GHZ
2.0 GHZ
睿频
发布时间
NA
Q1 2009
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Mobile AMD Sempron 3400+与Qualcomm Technologies, Inc SDM636对比
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