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Qualcomm Technologies, Inc SDM460与Mobile AMD Sempron 3300+对比
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Qualcomm Technologies, Inc SDM460与Mobile AMD Sempron 3300+对比
作者：admin 更新时间：2025-01-11 21:46
参数对比
提醒：数据来源与网络，仅供参考!
名称
Qualcomm Technologies, Inc SDM460
Mobile AMD Sempron 3300+
得分
1,861
294
TDP
TDP Down
插槽类型
核心数
8
1
线程数
8
1
主频
1.8 GHZ
2.0 GHZ
睿频
发布时间
NA
Q1 2009
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Mobile AMD Sempron 3300+与Qualcomm Technologies, Inc SDM460对比
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