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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与Mobile AMD Sempron 2800+对比
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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与Mobile AMD Sempron 2800+对比
作者:admin 更新时间:2025-01-06 17:49
参数对比
提醒:数据来源与网络,仅供参考!
名称
Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre
Mobile AMD Sempron 2800+
得分
566
237
TDP
TDP Down
插槽类型
核心数
4
1
线程数
4
1
主频
2.3 GHZ
1.6 GHZ
睿频
发布时间
NA
Q1 2009
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Mobile AMD Sempron 2800+与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
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