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Hisilicon Kirin970与Qualcomm Technologies, Inc SM6125对比
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Hisilicon Kirin970与Qualcomm Technologies, Inc SM6125对比
作者：admin 更新时间：2025-01-25 17:57
参数对比
提醒：数据来源与网络，仅供参考!
名称
Hisilicon Kirin970
Qualcomm Technologies, Inc SM6125
得分
2,243
2,041
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
2,362.0 GHZ
2.0 GHZ
睿频
发布时间
NA
NA
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Qualcomm Technologies, Inc SM6125与Hisilicon Kirin970对比
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