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Hisilicon Kirin970与Qualcomm Technologies, Inc SDM630对比
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Hisilicon Kirin970与Qualcomm Technologies, Inc SDM630对比
作者：admin 更新时间：2025-01-10 21:22
参数对比
提醒：数据来源与网络，仅供参考!
名称
Hisilicon Kirin970
Qualcomm Technologies, Inc SDM630
得分
2,243
1,700
TDP
TDP Down
插槽类型
核心数
8
8
线程数
8
8
主频
2,362.0 GHZ
2.2 GHZ
睿频
发布时间
NA
NA
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Qualcomm Technologies, Inc SDM630与Hisilicon Kirin970对比
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