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Hisilicon Kirin970与Qualcomm Technologies, Inc SDM429对比
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Hisilicon Kirin970与Qualcomm Technologies, Inc SDM429对比
作者:admin 更新时间:2024-11-24 18:30
参数对比
提醒:数据来源与网络,仅供参考!
名称
Hisilicon Kirin970
Qualcomm Technologies, Inc SDM429
得分
2,243
861
TDP
TDP Down
插槽类型
核心数
8
4
线程数
8
4
主频
2,362.0 GHZ
2.0 GHZ
睿频
发布时间
NA
NA
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Qualcomm Technologies, Inc SDM429与Hisilicon Kirin970对比
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