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VIA Samuel 2与Qualcomm Technologies, Inc SDM630对比
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VIA Samuel 2与Qualcomm Technologies, Inc SDM630对比
作者：admin 更新时间：2025-02-15 12:51
参数对比
提醒：数据来源与网络，仅供参考!
名称
VIA Samuel 2
Qualcomm Technologies, Inc SDM630
得分
79
1,700
TDP
TDP Down
插槽类型
核心数
1
8
线程数
8
主频
2.2 GHZ
睿频
发布时间
Q4 2011
NA
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Qualcomm Technologies, Inc SDM630与VIA Samuel 2对比
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