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VIA Samuel 2与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
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VIA Samuel 2与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
作者：admin 更新时间：2025-02-06 21:08
参数对比
提醒：数据来源与网络，仅供参考!
名称
VIA Samuel 2
Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre
得分
79
566
TDP
TDP Down
插槽类型
核心数
1
4
线程数
4
主频
2.3 GHZ
睿频
发布时间
Q4 2011
NA
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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与VIA Samuel 2对比
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