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VIA C3 Ezra与Qualcomm Technologies, Inc SDM670对比
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VIA C3 Ezra与Qualcomm Technologies, Inc SDM670对比
作者:admin 更新时间:2024-11-01 21:31
参数对比
提醒:数据来源与网络,仅供参考!
名称
VIA C3 Ezra
Qualcomm Technologies, Inc SDM670
得分
100
2,126
TDP
TDP Down
插槽类型
核心数
1
8
线程数
8
主频
1.4 GHz
2.0 GHZ
睿频
1.4 GHz
发布时间
Q2 2012
NA
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