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Mobile AMD Sempron 3600+与Qualcomm Technologies, Inc SDM845对比
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Mobile AMD Sempron 3600+与Qualcomm Technologies, Inc SDM845对比
作者：admin 更新时间：2025-02-07 14:49
参数对比
提醒：数据来源与网络，仅供参考!
名称
Mobile AMD Sempron 3600+
Qualcomm Technologies, Inc SDM845
得分
302
3,191
TDP
25 W
TDP Down
插槽类型
S1
核心数
1
8
线程数
1
8
主频
2.2 GHZ
2.8 GHz
睿频
发布时间
Q1 2009
Q1 2021
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Qualcomm Technologies, Inc SDM845与Mobile AMD Sempron 3600+对比
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