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Mobile AMD Sempron 3400+与Qualcomm Technologies, Inc SDM460对比
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Mobile AMD Sempron 3400+与Qualcomm Technologies, Inc SDM460对比
作者：admin 更新时间：2025-01-24 12:18
参数对比
提醒：数据来源与网络，仅供参考!
名称
Mobile AMD Sempron 3400+
Qualcomm Technologies, Inc SDM460
得分
321
1,861
TDP
25 W
TDP Down
插槽类型
SocketS1(S1g1)
核心数
1
8
线程数
1
8
主频
2.0 GHZ
1.8 GHZ
睿频
发布时间
Q1 2009
NA
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Qualcomm Technologies, Inc SDM460与Mobile AMD Sempron 3400+对比
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