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Mobile AMD Sempron 3300+与Qualcomm Technologies, Inc BENGALP对比
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Mobile AMD Sempron 3300+与Qualcomm Technologies, Inc BENGALP对比
作者：admin 更新时间：2025-01-24 19:43
参数对比
提醒：数据来源与网络，仅供参考!
名称
Mobile AMD Sempron 3300+
Qualcomm Technologies, Inc BENGALP
得分
294
2,134
TDP
TDP Down
插槽类型
核心数
1
8
线程数
1
8
主频
2.0 GHZ
2.0 GHZ
睿频
发布时间
Q1 2009
NA
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Qualcomm Technologies, Inc BENGALP与Mobile AMD Sempron 3300+对比
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