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Mobile AMD Sempron 3300+与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
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Mobile AMD Sempron 3300+与Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre对比
作者：admin 更新时间：2025-01-11 00:00
参数对比
提醒：数据来源与网络，仅供参考!
名称
Mobile AMD Sempron 3300+
Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre
得分
294
566
TDP
TDP Down
插槽类型
核心数
1
4
线程数
1
4
主频
2.0 GHZ
2.3 GHZ
睿频
发布时间
Q1 2009
NA
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Qualcomm MSM 8974 HAMMERHEAD (Flattened Device Tre与Mobile AMD Sempron 3300+对比
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