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Mobile AMD Sempron 3200+与Samsung J7 Max LTE SWA board based on MT6757V/WL对比
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Mobile AMD Sempron 3200+与Samsung J7 Max LTE SWA board based on MT6757V/WL对比
作者:admin 更新时间:2025-01-09 05:28
参数对比
提醒:数据来源与网络,仅供参考!
名称
Mobile AMD Sempron 3200+
Samsung J7 Max LTE SWA board based on MT6757V/WL
得分
245
950
TDP
TDP Down
插槽类型
核心数
1
8
线程数
1
8
主频
1.8 GHZ
2.4 GHZ
睿频
发布时间
Q4 2008
NA
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Samsung J7 Max LTE SWA board based on MT6757V/WL与Mobile AMD Sempron 3200+对比
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