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Mobile AMD Sempron 3200+与Qualcomm Technologies, Inc SDM670对比
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Mobile AMD Sempron 3200+与Qualcomm Technologies, Inc SDM670对比
作者：admin 更新时间：2025-02-13 00:55
参数对比
提醒：数据来源与网络，仅供参考!
名称
Mobile AMD Sempron 3200+
Qualcomm Technologies, Inc SDM670
得分
245
2,126
TDP
TDP Down
插槽类型
核心数
1
8
线程数
1
8
主频
1.8 GHZ
2.0 GHZ
睿频
发布时间
Q4 2008
NA
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Qualcomm Technologies, Inc SDM670与Mobile AMD Sempron 3200+对比
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