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Mobile AMD Sempron 3200+与Qualcomm Technologies, Inc MSM8937对比
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Mobile AMD Sempron 3200+与Qualcomm Technologies, Inc MSM8937对比
作者:admin 更新时间:2025-01-06 23:04
参数对比
提醒:数据来源与网络,仅供参考!
名称
Mobile AMD Sempron 3200+
Qualcomm Technologies, Inc MSM8937
得分
245
979
TDP
TDP Down
插槽类型
核心数
1
8
线程数
1
8
主频
1.8 GHZ
1.4 GHZ
睿频
发布时间
Q4 2008
NA
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Qualcomm Technologies, Inc MSM8937与Mobile AMD Sempron 3200+对比
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