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Mobile AMD Sempron 3200+与Samsung A13 USA SINGLE REV02B board based on EXYNO对比
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Mobile AMD Sempron 3200+与Samsung A13 USA SINGLE REV02B board based on EXYNO对比
作者：admin 更新时间：2024-11-24 05:37
参数对比
提醒：数据来源与网络，仅供参考!
名称
Mobile AMD Sempron 3200+
Samsung A13 USA SINGLE REV02B board based on EXYNO
得分
245
1,528
TDP
TDP Down
插槽类型
核心数
1
8
线程数
1
8
主频
1.8 GHZ
2.0 GHZ
睿频
发布时间
Q4 2008
NA
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Samsung A13 USA SINGLE REV02B board based on EXYNO与Mobile AMD Sempron 3200+对比
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